Tallenna
3D Microelectronic Packaging
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
- Alaotsikko
- From Architectures to Applications
- Toimittaja
- Yan Li, Deepak Goyal
- Painos
- Second Edition 2021
- ISBN
- 9789811570896
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 24.11.2020
- Kustantaja
- Springer Verlag, Singapore
- Sivumäärä
- 622
