Tallenna
3D Microelectronic Packaging
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
- Alaotsikko
- From Fundamentals to Applications
- Toimittaja
- Yan Li, Deepak Goyal
- Painos
- Softcover reprint of the original 1st ed. 2017
- ISBN
- 9783319830865
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 13.7.2018
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 463
