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3D Microelectronic Packaging
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3D Microelectronic Packaging

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

Undertittel
From Architectures to Applications
Opplag
Second Edition 2021
ISBN
9789811570926
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
24.11.2021
Antall sider
622