
3D Microelectronic Packaging
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
- Undertittel
- From Architectures to Applications
- Redaktør
- Yan Li, Deepak Goyal
- Opplag
- Second Edition 2021
- ISBN
- 9789811570896
- Språk
- Engelsk
- Vekt
- 446 gram
- Utgivelsesdato
- 24.11.2020
- Antall sider
- 622
