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3D Interconnect Architectures for Heterogeneous Technologies
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3D Interconnect Architectures for Heterogeneous Technologies

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Undertittel
Modeling and Optimization
Opplag
2022 ed.
ISBN
9783030982317
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
29.6.2023
Antall sider
395