
3D Interconnect Architectures for Heterogeneous Technologies
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
- Undertittel
- Modeling and Optimization
- Opplag
- 2022 ed.
- ISBN
- 9783030982287
- Språk
- Engelsk
- Vekt
- 446 gram
- Utgivelsesdato
- 28.6.2022
- Antall sider
- 395
