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3D Interconnect Architectures for Heterogeneous Technologies
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3D Interconnect Architectures for Heterogeneous Technologies

1 474,-

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Undertittel
Modeling and Optimization
Opplag
2022 ed.
ISBN
9783030982287
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
28.6.2022
Antall sider
395