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Wafer-Level Chip-Scale Packaging
Tallenna

Wafer-Level Chip-Scale Packaging

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Alaotsikko
Analog and Power Semiconductor Applications
Kirjailija
Shichun Qu, Yong Liu
Painos
Softcover reprint of the original 1st ed. 2015
ISBN
9781493954384
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
23.8.2016
Sivumäärä
322