Tallenna
Transactions on Engineering Technologies
nidottu, 2021
englanti
Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications.
- Alaotsikko
- World Congress on Engineering 2018
- Toimittaja
- Sio-Iong Ao, Len Gelman, Haeng Kon Kim
- Painos
- 2019 ed.
- ISBN
- 9789813295339
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 26.8.2021
- Kustantaja
- Springer Verlag, Singapore
- Sivumäärä
- 363
