Tallenna
Packaging of High Power Semiconductor Lasers
Kirjailija:
nidottu, 2016
englanti
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
- Kirjailija
- Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
- Painos
- Softcover reprint of the original 1st ed. 2015
- ISBN
- 9781493955909
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 1.10.2016
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 402
