Packaging of High Power Semiconductor Lasers
218,80 €
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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
- Kirjailija
- Liu Xingsheng, Zhao Wei, Xiong Lingling, Liu Hui
- ISBN
- 9781461492627
- Kieli
- englanti
- Paino
- 518 grammaa
- Julkaisupäivä
- 15.7.2014
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 402
