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Manufacturing Challenges in Electronic Packaging
Tallenna

Manufacturing Challenges in Electronic Packaging

About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
Toimittaja
Y.C. Lee, W.T. Chen
Painos
Softcover reprint of the original 1st ed. 1998
ISBN
9781461376590
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
25.9.2012
Sivumäärä
261