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Manufacturing Challenges in Electronic Packaging

Sidottu, 1997
englanti
129,70 €

This work provides a single source reference that addresses both advanced packaging and manufacturing activities, with reviews and in-depth analyses. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. This book should be of interest to professional/technical readers: packaging or manufacturing engineers/product designers in electronic hardware; and academics.

Toimittaja
Y.C. Lee, Chen W.T.
Painos
1998
ISBN
9780412620300
Kieli
englanti
Paino
518 grammaa
Julkaisupäivä
31.12.1997
Sivumäärä
261