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Electronics Production Defects and Analysis
Tallenna

Electronics Production Defects and Analysis

These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout.
Painos
2022 ed.
ISBN
9789811698262
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
10.4.2023
Sivumäärä
140