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Electronics Production Defects and Analysis
Tallenna

Electronics Production Defects and Analysis

These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout.
Painos
2022 ed.
ISBN
9789811698231
Kieli
englanti
Paino
446 grammaa
Julkaisupäivä
9.4.2022
Sivumäärä
140