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Arbitrary Modeling of TSVs for 3D Integrated Circuits
Tallenna

Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
Painos
Softcover reprint of the original 1st ed. 2015
ISBN
9783319374970
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
23.8.2016
Sivumäärä
179