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Advances in Condition Monitoring and Structural Health Monitoring
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Advances in Condition Monitoring and Structural Health Monitoring

This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019.
Alaotsikko
WCCM 2019
Painos
1st ed. 2021
ISBN
9789811591983
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
3.2.2021
Sivumäärä
795