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3D Microelectronic Packaging
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3D Microelectronic Packaging

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

Undertitel
From Architectures to Applications
Upplaga
Second Edition 2021
ISBN
9789811570896
Språk
Engelska
Vikt
446 gram
Utgivningsdatum
2020-11-24
Sidor
622