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Arbitrary Modeling of TSVs for 3D Integrated Circuits
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Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
Opplag
Softcover reprint of the original 1st ed. 2015
ISBN
9783319374970
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
23.8.2016
Antall sider
179