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Arbitrary Modeling of TSVs for 3D Integrated Circuits
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Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
ISBN
9783319076102
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
5.9.2014
Antall sider
179