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3D Stacked Chips
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3D Stacked Chips

innbundet, 2016
Engelsk
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
Undertittel
From Emerging Processes to Heterogeneous Systems
Opplag
1st ed. 2016
ISBN
9783319204802
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
23.5.2016
Antall sider
339