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Wafer-Level Chip-Scale Packaging
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Wafer-Level Chip-Scale Packaging

Forfatter:
Engelsk
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Undertittel
Analog and Power Semiconductor Applications
Opplag
Softcover reprint of the original 1st ed. 2015
ISBN
9781493954384
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
23.8.2016
Antall sider
322