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Wafer-Level Chip-Scale Packaging
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Wafer-Level Chip-Scale Packaging

Forfatter:
innbundet, 2014
Engelsk
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
Undertittel
Analog and Power Semiconductor Applications
Opplag
2015 ed.
ISBN
9781493915552
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
11.9.2014
Antall sider
322