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Thermal Stress and Strain in Microelectronics Packaging
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Thermal Stress and Strain in Microelectronics Packaging

Engelsk
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
Redaktør
John Lau
Opplag
Softcover reprint of the original 1st ed. 1993
ISBN
9781468477696
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
30.4.2012
Antall sider
884