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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Forfatter:
Engelsk
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
Forfatter
Gerard Kelly
Opplag
Softcover reprint of the original 1st ed. 1999
ISBN
9781461372769
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
8.10.2012
Antall sider
134