System-in-Package RF Design and Application

Here's the first book that offers practical guidance on SiP (system-in-package) RF design techniques for today's complex wireless devices. It offers a solid grasp of RF components together with state-of-the-art packaging strategies to help you meet today's increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost. This comprehensive how tou resource explains design rules for laminate and LTCC modules and the trade-offs between them, and presents expert working guidelines to help you make smart IC partitioning decisions early in the design phase. You get full details on embedded filter designs with RF architecture trade-offs for performance and cost. Other passive circuitry is also detailed like couplers, BALUNs, and antenna switches that can be integrated in the package to save cost and space. The book addresses advanced techniques enabling the integration of all wireless functions into one module, and explores up-and-coming embedded passive and embedded die capability pointing the way to ever-smaller modules with marginal cost impact. Moreover, you find details on shielding for a complete licensed transceiver. Real-worldu issues pertaining to RX architecture with VCO grounding, power control EVM effects, and modeling round out the coverage, and plentiful examples illustrate capabilities, constraints, trade-offs, and options at every step. Supported by over 100 illustrations, this book is indispensable in tackling the challenges of RF system integration in a module package.