Spar
Solder Paste in Electronics Packaging
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
- Undertittel
- Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
- Forfatter
- Jennie S. Hwang
- Opplag
- Softcover reprint of the original 1st ed. 1989
- ISBN
- 9789401160520
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 20.2.2012
- Forlag
- Springer
- Antall sider
- 456
