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RF and Microwave Microelectronics Packaging II
heftet, 2018
Engelsk
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
- Redaktør
- Ken Kuang, Rick Sturdivant
- Opplag
- Softcover reprint of the original 1st ed. 2017
- ISBN
- 9783319847191
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 9.6.2018
- Antall sider
- 172
