Multichip Module Technologies and Alternatives: The Basics

This study provides a framework for understanding the multichip module (MCM) technologies available for package selection. It considers system needs, costs and such technical considerations as electrical and thermal design, materials and processes, chip and substrate attach options, and test, assembly and repair requirements. In addition to offering techniques on MCM construction, the book reveals the decision-making process involved in the design, fabrication, manufacturing and marketing of an MCM-based product. Case studies, drawn from the practical experiences of leading MCM manufacturers in the computer, military and aerospace industries, illustrate technical and decision-making strategies.