Spar
Materials for Advanced Packaging
heftet, 2018
Engelsk
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
- Opplag
- Softcover reprint of the original 2nd ed. 2017
- ISBN
- 9783319832098
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 8.6.2018
- Antall sider
- 969
