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Materials for Advanced Packaging
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Materials for Advanced Packaging

innbundet, 2016
Engelsk
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
Opplag
2nd ed. 2017
ISBN
9783319450971
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
30.12.2016
Antall sider
969