
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
- Forfatter
- Qingke Zhang
- Opplag
- Softcover reprint of the original 1st ed. 2016
- ISBN
- 9783662517253
- Språk
- Engelsk
- Vekt
- 310 gram
- Serie
- Springer Theses
- Utgivelsesdato
- 23.8.2016
- Antall sider
- 143
