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Interconnect Reliability in Advanced Memory Device Packaging
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Interconnect Reliability in Advanced Memory Device Packaging

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.

In the past 40 years, memory packaging processes have evolved enormously.

Opplag
2023 ed.
ISBN
9783031267079
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
29.4.2023
Antall sider
210