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Integrated Circuit Packaging, Assembly and Interconnections
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Integrated Circuit Packaging, Assembly and Interconnections

Forfatter:
Engelsk

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.

Forfatter
William Greig
Opplag
Softcover reprint of hardcover 1st ed. 2007
ISBN
9781441939234
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
29.10.2010
Antall sider
300