
Integrated Circuit Packaging, Assembly and Interconnections
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing.
- Forfatter
- William Greig
- Opplag
- Softcover reprint of hardcover 1st ed. 2007
- ISBN
- 9781441939234
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 29.10.2010
- Antall sider
- 300
