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Heterogeneous Integrations
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Heterogeneous Integrations

Forfatter:
innbundet, 2019
Engelsk
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
Forfatter
John H. Lau
Opplag
2019 ed.
ISBN
9789811372230
Språk
Engelsk
Vekt
446 gram
Utgivelsesdato
12.4.2019
Antall sider
368