
Fundamentals of Lead-Free Solder Interconnect Technology
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
- Undertittel
- From Microstructures to Reliability
- Forfatter
- Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
- Opplag
- Softcover reprint of the original 1st ed. 2015
- ISBN
- 9781489978011
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 1.10.2016
- Antall sider
- 253
