Spar
Fundamentals of Lead-Free Solder Interconnect Technology
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
- Undertittel
- From Microstructures to Reliability
- Forfatter
- Hongtao Ma, Thomas R. Bieler, Choong-Un Kim, Tae-Kyu Lee
- ISBN
- 9781461492665
- Språk
- Engelsk
- Utgivelsesdato
- 5.11.2014
- Forlag
- SPRINGER US
- Tilgjengelige elektroniske format
- PDF - Adobe DRM
- Les e-boka her
- E-bokleser i mobil/nettbrett
- Lesebrett
- Datamaskin
