Foldable Flex and Thinned Silicon Multichip Packaging Technology
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).
- Redaktør
- John W. Balde
- Opplag
- Softcover reprint of the original 1st ed. 2003
- ISBN
- 9781461349778
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 23.2.2014
- Antall sider
- 347
