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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis.
Opplag
Softcover reprint of the original 1st ed. 2003
ISBN
9781461349891
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
14.10.2012
Antall sider
185