
Fan-Out Wafer-Level Packaging
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
- Forfatter
- John H. Lau
- Opplag
- 2018 ed.
- ISBN
- 9789811088834
- Språk
- Engelsk
- Vekt
- 446 gram
- Utgivelsesdato
- 13.4.2018
- Antall sider
- 303
