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Electrical Design of Through Silicon Via
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Electrical Design of Through Silicon Via

Engelsk
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
Opplag
Softcover reprint of the original 1st ed. 2014
ISBN
9789401779494
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
27.9.2016
Forlag
Springer
Antall sider
280