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Die-stacking Architecture
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Die-stacking Architecture

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
ISBN
9783031006197
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
10.6.2015
Antall sider
113