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Bonding in Microsystem Technology
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Bonding in Microsystem Technology

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Opplag
Softcover reprint of hardcover 1st ed. 2006
ISBN
9789048171514
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
25.11.2010
Forlag
Springer
Antall sider
334