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Advances in Electronic Circuit Packaging
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Advances in Electronic Circuit Packaging

Engelsk
Undertittel
Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Opplag
Softcover reprint of the original 1st ed. 1962
ISBN
9781489972972
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
1.1.1962
Antall sider
328