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3D Stacked Chips
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3D Stacked Chips

Engelsk
590,-
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
Undertittel
From Emerging Processes to Heterogeneous Systems
Opplag
Softcover reprint of the original 1st ed. 2016
ISBN
9783319793054
Språk
Engelsk
Vekt
310 gram
Utgivelsesdato
26.5.2018
Antall sider
339