Spar
3D Microelectronic Packaging
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.
- Undertittel
- From Fundamentals to Applications
- Redaktør
- Yan Li, Deepak Goyal
- Opplag
- Softcover reprint of the original 1st ed. 2017
- ISBN
- 9783319830865
- Språk
- Engelsk
- Vekt
- 310 gram
- Utgivelsesdato
- 13.7.2018
- Antall sider
- 463
