Tin and Solder Plating in the Semiconductor Industry

Plating is an integral part of the semiconductor assembly process. Metal finishing not only prevents corrosion, but also ensures good solderability when the components are assembled on the printed circuit board. The objective of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve "zero-defect" plating by providing an understanding of the plating chemistry and the handling of the plated parts. Beginning with an introduction to electronic packaging materials such as epoxy moulding compounds, sealing glass and leadframes, the book systematically explains the basics of plating, the chemistry of cleaning, the plating operation, process control, corrosion, alloy plating and the methodology of "trouble-shooting". In addition, comparison is made between the plating process and the solder dipping process, and the selection of the composition of tin-lead alloy.