Three Dimensional System Integration
Sidottu, 2010
englanti
73,60 €
Lisää toivelistalle
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.
- Alaotsikko
- IC Stacking Process and Design
- Toimittaja
- Papanikolaou Antonis, Dimitrios Soudris, Radojcic Riko
- Painos
- 2011
- ISBN
- 9781441909619
- Kieli
- englanti
- Paino
- 518 grammaa
- Julkaisupäivä
- 15.12.2010
- Kustantaja
- Springer-Verlag New York Inc.
- Sivumäärä
- 246
