Tallenna
Three-Dimensional Integration of Semiconductors
nidottu, 2019
englanti
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
- Alaotsikko
- Processing, Materials, and Applications
- Toimittaja
- Kazuo Kondo, Morihiro Kada, Kenji Takahashi
- Painos
- Softcover reprint of the original 1st ed. 2015
- ISBN
- 9783319792552
- Kieli
- englanti
- Paino
- 310 grammaa
- Julkaisupäivä
- 28.3.2019
- Kustantaja
- Springer International Publishing AG
- Sivumäärä
- 408
