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Thermal Stress and Strain in Microelectronics Packaging
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Thermal Stress and Strain in Microelectronics Packaging

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.
Toimittaja
John Lau
Painos
Softcover reprint of the original 1st ed. 1993
ISBN
9781468477696
Kieli
englanti
Paino
310 grammaa
Julkaisupäivä
30.4.2012
Sivumäärä
884