Tallenna
Thermal Reliability of Power Semiconductor Device in the Renewable Energy System
Kirjailija:
sidottu, 2022
englanti
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.
- Kirjailija
- Xiong Du, Jun Zhang, Gaoxian Li, Yaoyi Yu, Cheng Qian, Rui Du
- Painos
- 2022 ed.
- ISBN
- 9789811931314
- Kieli
- englanti
- Paino
- 446 grammaa
- Julkaisupäivä
- 9.7.2022
- Kustantaja
- SPRINGER VERLAG, SINGAPORE
- Sivumäärä
- 172
